We provide an automated process for surface-mounting SMD components, including paste application inspection and automated optical inspection (AOI) as well as X-Ray inspection. SMD components can be mounted on both sides of the board using either leaded or lead-free technology.
We monitor and record production processes. Each electronic board is assigned a unique serial number, and information about the used components is stored in the database.
SMD assembly is carried out in a fully automated manner,
ensuring compliance with the required standards.
We have Fuji NXT machines that guarantee fast and reliable component assembly
The necessary equipment for verifying the correctness of assembly for modern multi-leaded devices, such as BGA and CSP.
Before the project enters production, we consult and suggest optimization changes.
Product and batch identification
Upon customer request, we label electronic boards with thermal transfer labels that can withstand extreme temperatures and are resistant to washing and abrasion.
Detailed quality control is conducted at every stage of production. Both automated optical inspection, X-ray inspection, and CCTV monitoring allow for continuous supervision of the production process.
Our production hall is climate-controlled, ensuring optimal temperature and humidity in the manufacturing environment. The hall is always kept clean and free from dust. CCTV monitoring enables continuous supervision by the management team over the production processes.
Take the first step! Write or call and let's talk about your project.
We will present you our offer and choose the optimal solution.